Vacuum Oven for Thick Film

Product Details
Customization: Available
Certification: ISO9001
Protection: Shock Resistance
Manufacturer/Factory
Gold Member Since 2012

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Management System Certification
ISO 9001, ISO 9000
  • Vacuum Oven for Thick Film
  • Vacuum Oven for Thick Film
  • Vacuum Oven for Thick Film
  • Vacuum Oven for Thick Film
  • Vacuum Oven for Thick Film
  • Vacuum Oven for Thick Film
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Basic Info.

Model NO.
HXV01202N
Installation
Vertical
Housing
Steel
Atmosphere
Air/Nz
Uniformity
±3ºC
Vacuum
≤10PA
Temp
Rt~170ºC
Chamber Size
550*530*430mm
Heating Stack
5 Stack
Transport Package
Standard Exported Package
Specification
CE, ISO9000,
Trademark
Hengli
Origin
Hefei, Anhui, China
HS Code
8514300090

Product Description


Vacuum Oven for Thick Film
Applications:Thick film, hybrid integrated circuits prior to sealing the vacuum baking process, especially for the aerospace industry and other products with a higher moisture content requirements:dehumidification drying of semiconductor and electronic components; conductive glue vacuum drying; Magnetic materials vacuum ex- haust glue, high temperature sintering. 
Features:Fast drying; precise temperature control; temperature, vacuum level and time can be simultaneously programmed control.
Type: Semiconductors electronic  components and other drying dehumidification application.
Options:Computer control system,oil less pumps water ring pumps.

We (Hengli Eletek)  have been designing and manufacturing industrial furnaces for over 30 years as part of a major electronics research institute. We were incorporated as a company in 1992 and today occupy a state-of-the-art ISO9001-certified design and manufacturing facility. Today, our furnaces are used by customers in Australia, Austria, Canada, China, Costa Rica, Hong Kong, Hungary, India, Indonesia, Israel, Italy, Malaysia, Mexico, Netherlands, Russia, Singapore, Slovenia, South Korea, Spain, Sri Lanka, Switzerland, Taiwan, Turkey, UK, USA and Vietnam. We have served the furnace needs of many renowned customers including Apple, IBM, Ferro, Eaton, Schott AG, EBG, First Solar, NASA, Neways Micro, Coilcraft, PCB, 3G Solar, Materion, and more.
Vacuum Oven for Thick Film
Furnace can be produced (procedure 90~135days) right away after pre-payment confirmation. COSCO Maersk MSC ship to worldwide for safe shipping, don't worry about package damage or loss. It takes about 15-40 days to worldwide, Please note us your contact details include your phone number for easy contacting from shipping company officer.
 By Sea Delivery from Shanghai seaport
By Air Departure from Shanghai Pudong Airport
By Express Post by DHL, EMS, UPS, TNT, FedEx.
Vacuum Oven for Thick Film
Vacuum Oven for Thick Film

Payment Terms
 
 
T/T
EXW  
 
50% T/T in advance, the rest balance paid before shipment
FOB
CFR
CIF
L/C          L/C amount above 200,000 USD, we can accept L/C at sight

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