Application of this oven: HSG 6310-0503 drying furnace is designed for drying and curing of electronic products, it also can be used for drying of organic solvent on the metal surface.
Features of this oven: Infrared heating, super light insulation materials, efficient use of energy, high speed, and high efficiency.
Operating Temperature of this oven: RT~250ºC.
Options: Protective atmosphere, forced exhaust system, temperature profiling system, computer monitoring system, ultrasonic belt cleaning system, etc.
Heating Mode: use quartz tube to heat from single side and use full ceramic fibre as insulating material. It has advantage of good insulation performance, fast temperature rise, energy saving, time saving and easy to control RT temperature.
Note: We can customize according to customer's requirement
We (Hengli Eletek) have been designing and manufacturing industrial furnaces for over 30 years as part of a major electronics research institute. We were incorporated as a company in 1992 and today occupy a state-of-the-art ISO9001-certified design and manufacturing facility. Today, our furnaces are used by customers in Australia, Austria, Canada, China, Costa Rica, Hong Kong, Hungary, India, Indonesia, Israel, Italy, Malaysia, Mexico, Netherlands, Russia, Singapore, Slovenia, South Korea, Spain, Sri Lanka, Switzerland, Taiwan, Turkey, UK, USA and Vietnam. We have served the furnace needs of many renowned customers including Apple, IBM, Ferro, Eaton, Schott AG, EBG, First Solar, NASA, Neways Micro, Coilcraft, PCB, 3G Solar, Materion, and more.
Furnace can be produced (procedure 90~135days) right away after pre-payment confirmation. COSCO Maersk MSC ship to worldwide for safe shipping, don't worry about package damage or loss. It takes about 15-40 days to worldwide, Please note us your contact details include your phone number for easy contacting from shipping company officer.
| By Sea |
Delivery from Shanghai seaport |
| By Air |
Departure from Shanghai Pudong Airport |
| By Express |
Post by DHL, EMS, UPS, TNT, FedEx. |
Payment Terms |
T/T |
EXW |
50% T/T in advance, the rest balance paid before shipment |
| FOB |
| CFR |
| CIF |
| L/C |
L/C amount above 200,000 USD, we can accept L/C at sight |
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Application of this oven: HSG 6310-0503 drying furnace is designed for drying and curing of electronic products, it also can be used for drying of organic solvent on the metal surface.
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