The High-Temperature Firing Furnace for Chip Electronic Components

Product Details
Customization: Available
After-sales Service: 12 Months
Warranty: 12 Months
Manufacturer/Factory
Gold Member Since 2012

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Management System Certification
ISO 9001, ISO 9000
  • The High-Temperature Firing Furnace for Chip Electronic Components
  • The High-Temperature Firing Furnace for Chip Electronic Components
  • The High-Temperature Firing Furnace for Chip Electronic Components
  • The High-Temperature Firing Furnace for Chip Electronic Components
  • The High-Temperature Firing Furnace for Chip Electronic Components
  • The High-Temperature Firing Furnace for Chip Electronic Components
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Basic Info.

Certification
CE, ISO
Structure
Horizontal Type
Brand
Hengli
Heating Power
75kw
Heating Zone
5
Thermocouple
K Type
Temperature Control Stability
+-1c
Temperature Uniformity
+-3c
Transport Package
Wooden Box Iron Bracket
Specification
50900*3730*2000mm
Trademark
HENGLI
Origin
China
HS Code
8514390090
Production Capacity
300set/Year

Product Description

Typical Applications Mainly used for high-temperature sintering of thick film circuits, precision resistors, chip electronic components, LTCC, glass glazes, ceramic filters, and annealing of photovoltaic thin film glass.
Rated temperature 900ºC
Max. temperature 1050ºC
Heating element Heating plate
Heating power 141kW
Insulation Power ≤149kW
Heating zone : 11
Temperature Control Point 33 points
Thermocouple K type
Surface Temperature Heat up(not include the top of chamber) <35ºC
Temperature Control Stability ±1ºC
Temperature Uniformity ±2ºC(Flat-Temperature zone)

We (Hengli Eletek)  have been designing and manufacturing industrial furnaces for over 30 years as part of a major electronics research institute. We were incorporated as a company in 1992 and today occupy a state-of-the-art ISO9001-certified design and manufacturing facility. Today, our furnaces are used by customers in Australia, Austria, Canada, China, Costa Rica, Hong Kong, Hungary, India, Indonesia, Israel, Italy, Malaysia, Mexico, Netherlands, Russia, Singapore, Slovenia, South Korea, Spain, Sri Lanka, Switzerland, Taiwan, Turkey, UK, USA and Vietnam. We have served the furnace needs of many renowned customers including Apple, IBM, Ferro, Eaton, Schott AG, EBG, First Solar, NASA, Neways Micro, Coilcraft, PCB, 3G Solar, Materion, and more.
The High-Temperature Firing Furnace for Chip Electronic Components
Furnace can be produced (procedure 90~135days) right away after pre-payment confirmation. COSCO Maersk MSC ship to worldwide for safe shipping, don't worry about package damage or loss. It takes about 15-40 days to worldwide, Please note us your contact details include your phone number for easy contacting from shipping company officer.
 By Sea Delivery from Shanghai seaport
By Air Departure from Shanghai Pudong Airport
By Express Post by DHL, EMS, UPS, TNT, FedEx.
The High-Temperature Firing Furnace for Chip Electronic Components
The High-Temperature Firing Furnace for Chip Electronic Components

Payment Terms
 
 
T/T
EXW  
 
50% T/T in advance, the rest balance paid before shipment
FOB
CFR
CIF
L/C          L/C amount above 200,000 USD, we can accept L/C at sight
The High-Temperature Firing Furnace for Chip Electronic Components

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