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Application scope:Gold, silver and nickel plating of IC lead frame and package shell.<o:p>
Feature: Mechanical and Electrical Integration structure, easy operation, high reliability, use countercurrent rinsing and micro drain techniques, energy saving, friendly environment. <o:p>
Technical Specification: Non-standard specifications, it is customized.<o:p>
Options: Computer monitoring system, bath solution testing and automatic feed device, cathode shifter.<o:p>
Suppliers with verified business licenses