Applications of Box Oven:
HXV004-09 Medium Temp Box Oven is mainly designed for magnetic materials, electronic devices, ceramics, lithium battery cathode materials and other products firing process
Main Technical Specification:
Rated Temperature: 800ºC
Max Temperature: 900ºC
The Effective Dimension of the Chamber: 400×240mm(W×H)
Dimension of the Chamber: 400×465×800mm(W×H×D)
Effective size: 330mm×200mm×660mm (W×H×D)
Sagger size: 330mm×200mm×330mm(W×H×D)
Bearing mode: SiC roller support sagger, single layer double row
Heating Element: Ceramic tube winded with heating wire
Temperature control thermocouple: K type
Insulation material: The inner layer is made of light firebrick, and the outer layer is made of ceramic fiberboard
Temperature Control Point:upper and lower two points of temperature control, the middle point temperature measurement
Temperature Control Mode:imported temperature controller, ±1ºC, with PID parameter auto-setting function
Temperature Controlled Segment: 9 segments.
Oxygen content analyzer: online oxygen content analyzer is equipped to detect oxygen content in the furnace
Pressure detection: real-time display of furnace pressure through digital differential pressure meter
Chamber Temperature Uniformity: ±5ºC(flat temp950ºC test)
Notes: HengLi also manufactures custom designed furnaces.
Audited Supplier 
Applications of Box Oven:HXV004-09 Medium Temp Box Oven is mainly designed for magnetic materials, electronic devices, ceramics, lithium battery cathode materials and other products firing process
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