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  • Chip Component Barrel Plating Automatic Line
  • Chip Component Barrel Plating Automatic Line
  • Chip Component Barrel Plating Automatic Line

Chip Component Barrel Plating Automatic Line

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Basic Info.

Model NO.
Barrel plating line
Specification
CE, ISO9000, SGS,
Trademark
Hengli
Origin
China
HS Code
8543300090

Product Description

Application:The mass plating production of chip component and micro metal parts;Pretreatment, silver plating, nickel plating and tin plating of chip components.<o:p>

Project experiences:Electroplating production line for SMD and connectors etc.<o:p>

Feature:The roller is optimal designed of technology according customers requirements.   Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc,and is easy to adjust process parameter according to different process feature.<o:p>

Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-100 kg.<o:p>

Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.<o:p>
Chip Component Barrel Plating Automatic Line
Chip Component Barrel Plating Automatic LineChip Component Barrel Plating Automatic Line

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