• Push Kiln Furnace for Alumina Substrate Htcc
  • Push Kiln Furnace for Alumina Substrate Htcc
  • Push Kiln Furnace for Alumina Substrate Htcc
  • Push Kiln Furnace for Alumina Substrate Htcc
  • Push Kiln Furnace for Alumina Substrate Htcc
  • Push Kiln Furnace for Alumina Substrate Htcc

Push Kiln Furnace for Alumina Substrate Htcc

Production Scope: Product Line
Production continuity: Continuous
Condition: New
Automation: Automatic
After-sales Service: Engineers Available to Service Machinery Overseas
Max Temp: 1700ºC
Customization:
Gold Member Since 2012

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Manufacturer/Factory

Basic Info.

Model NO.
HT series
Atmosphere
H2+N2
Transport Package
Standard Exported Package
Specification
CE, ISO9000, SGS
Trademark
Hengli
Origin
China
HS Code
8514300090
Production Capacity
200 PCS/Year

Product Description

Application:
For binder burn outprefiring,firing and annealing of piezoelectricpressure sen- sitive,PTC NTC,patch antenna,filter,sil icon,nanometer,zirconia materials and electronic components.

Features:
1.Customized zones quantities and length according to different functional ceramics process, into the vent po- sition,the design of the cooling section;
2. Using upper and lower heating proportional control,light chamber materials,high efficiency and energy saving.precision temperature control.eneray saving and eco-friendly:
3.Customized chamber and atmosphere systemstablecontrolandatomsphere system;
4.Reliable and convenient drive system,hydraulic pressure and mechanical drive option.
5.Air, oxygen, nitrogen, argon and other process atmosphere can be introduced to meet the process a- tmosphere reguirements ofvarious materialsPush Kiln Furnace for Alumina Substrate Htcc
Model Push Board Dimension (mm) TemperatureRange Atmosphere
12mHTD7523-1009ZCN 340*340*30*2 200-900Deg. C. Air, oxygen, nitrogen, argon and other process atmosphere
16mHTD7523-1009ZCN
20mHTD7523-1009ZCN
24mHTD7523-1009ZCN
28mHTD7523-1009ZCN
We (Hengli Eletek)  have been designing and manufacturing industrial furnaces for over 30 years as part of a major electronics research institute. We were incorporated as a company in 1992 and today occupy a state-of-the-art ISO9001-certified design and manufacturing facility. Today, our furnaces are used by customers in Australia, Austria, Canada, China, Costa Rica, Hong Kong, Hungary, India, Indonesia, Israel, Italy, Malaysia, Mexico, Netherlands, Russia, Singapore, Slovenia, South Korea, Spain, Sri Lanka, Switzerland, Taiwan, Turkey, UK, USA and Vietnam. We have served the furnace needs of many renowned customers including Apple, IBM, Ferro, Eaton, Schott AG, EBG, First Solar, NASA, Neways Micro, Coilcraft, PCB, 3G Solar, Materion, and more.
Push Kiln Furnace for Alumina Substrate Htcc
Furnace can be produced (procedure 90~135days) right away after pre-payment confirmation. COSCO Maersk MSC ship to worldwide for safe shipping, don't worry about package damage or loss. It takes about 15-40 days to worldwide, Please note us your contact details include your phone number for easy contacting from shipping company officer.
 By Sea Delivery from Shanghai seaport
By Air Departure from Shanghai Pudong Airport
By Express Post by DHL, EMS, UPS, TNT, FedEx.
Push Kiln Furnace for Alumina Substrate Htcc
Push Kiln Furnace for Alumina Substrate Htcc

Payment Terms
 
 
T/T
EXW  
 
50% T/T in advance, the rest balance paid before shipment
FOB
CFR
CIF
L/C          L/C amount above 200,000 USD, we can accept L/C at sight
Push Kiln Furnace for Alumina Substrate Htcc

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